Toshiba Corporation has signed a memorandum of understanding (MoU) with ROHM Co., Ltd., Mitsubishi Electric Corporation, Japan Industrial Partners, and TBJ Holdings Corporation to begin discussions on a potential integration of their semiconductor and power device businesses.
The proposed integration would combine Toshiba Electronic Devices & Storage Corporation’s semiconductor operations with ROHM’s semiconductor business and Mitsubishi Electric’s power device division. The initiative aims to create a larger, more competitive entity capable of strengthening Japan’s position in the global power semiconductor market.
This development builds on ongoing collaboration between Toshiba and ROHM, including a joint plan submitted in 2023 to Japan’s Ministry of Economy, Trade and Industry to support domestic power semiconductor production. That initiative was recognized under government programs aimed at securing stable semiconductor supply chains.
Strategically, the inclusion of Mitsubishi Electric signals an ambition to achieve greater scale and technological depth, particularly in power devices—an area critical for electrification, renewable energy, and industrial systems. The integration could enhance manufacturing efficiency, expand customer reach, and consolidate R&D capabilities across the participating companies.
From a market perspective, this move reflects increasing regional consolidation efforts in response to intensifying global competition, especially from leading players in Europe, the U.S., and China. Japan is seeking to reinforce its domestic semiconductor ecosystem, particularly in power semiconductors where it retains strong technological heritage but faces scale challenges.
At this stage, the agreement marks the start of formal discussions. No final decisions have been made regarding transaction structure or implementation, with further details to be determined as negotiations progress.
Original – Toshiba