Okmetic has expanded its wafer portfolio to include 300 mm polished wafers and 150–300 mm epitaxial (EPI) wafers through qualified manufacturing partners, strengthening its position as a Europe-based supplier across multiple semiconductor segments.
The company will continue its in-house production of advanced 150–200 mm silicon and bonded SOI wafers, while leveraging external partners for larger wafer sizes and EPI solutions. Despite outsourcing production, Okmetic retains full responsibility for supply chain management and wafer quality, ensuring consistent performance and customer experience.
This hybrid manufacturing model enhances supply flexibility and enables Okmetic to address a broader range of applications, including memory, logic, power, RF, and mixed-signal devices. At the same time, the company maintains strong support for its core markets such as MEMS, sensors, and power semiconductors. Notably, Okmetic also continues to support long-term demand for 150 mm wafers, while its expanded 200 mm polished wafer capacity entered volume production in early 2026.
From a market perspective, this move reflects increasing demand for diversified wafer sourcing strategies, particularly as customers balance legacy nodes (150/200 mm) with advanced 300 mm manufacturing. By combining internal capabilities with partner manufacturing, Okmetic is aligning with industry trends toward supply chain resilience, multi-sourcing, and scalable capacity.
The expansion also positions Okmetic to better support evolving device architectures, including GaN-on-Si and advanced power devices, where substrate quality and availability remain critical. Ongoing R&D collaboration with customers and research partners further supports future technology roadmaps and next-generation semiconductor applications.
Original – Okmetic