Microchip Technology announced its new BZPACK mSiC® power modules, designed to meet stringent high humidity, high voltage, high temperature reverse bias (HV-H3TRB) standards for demanding power conversion environments.
The BZPACK modules are available in multiple configurations, including half-bridge, full-bridge, three-phase and PIM/CIB topologies, providing flexibility for designers to optimize system performance, cost and architecture across industrial and renewable energy applications.
The modules are tested to exceed the 1,000-hour HV-H3TRB standard, ensuring robust long-term reliability in harsh environments. With a Comparative Tracking Index of 600 V, stable RDS(on) across temperature ranges and substrate options such as aluminum oxide and aluminum nitride, the devices offer strong insulation, effective thermal management and durability.
To simplify manufacturing and integration, the BZPACK modules feature a compact, baseplate-less design with press-fit, solderless terminals and optional pre-applied thermal interface material. These features help reduce assembly complexity, improve manufacturing consistency and enable easier multi-sourcing through industry-standard footprints. The modules are also pin-compatible to support design flexibility.
The portfolio is supported by Microchip’s MB and MC families of mSiC MOSFETs, which are available for industrial and automotive applications, including AEC-Q101 qualified options. These devices support standard gate-source voltages of 15 V or higher and are offered in common industry packages such as TO-247-4.
The MC family additionally integrates a gate resistor, improving switching control and stability in multi-die module configurations while maintaining low switching energy. The modules are designed to reduce the risk of field failures associated with moisture-induced leakage or breakdown, supporting reliable operation in high-stress environments.
Original – Microchip Technology