Infineon Technologies announced two new high-voltage intermediate bus converter (HV IBC) reference designs aimed at accelerating the adoption of next-generation AI server power architectures based on ±400 V and 800 V DC distribution.

The new designs are enabled by Infineon’s 650 V CoolGaN™ switches and target hyperscalers, power architects and server OEMs seeking higher rack power, reduced distribution losses and improved thermal performance in AI data centers.

The first reference design converts 800 V DC or ±400 V to 50 V and serves as an intermediate stage for downstream 48 V IBC modules. The second design enables direct conversion from 800 V DC to 12 V, supporting compact server board implementations. For flexible system configurations, the designs can be paired with Infineon’s XDPP1188-200C digital controller, which supports output voltages of 48 V, 24 V or 12 V.

The 800 V to 50 V design achieves more than 98 percent efficiency at full load and is built using CoolGaN switches, EiceDRIVER gate drivers and a PSOC microcontroller. It consists of two 3 kW converter blocks arranged in an input-series-output-parallel configuration, scaling to 6 kW total design power and supporting peak loads up to 10.8 kW. The system uses a planar PCB-integrated transformer and soft-switching operation to reduce electromagnetic interference, achieving a compact 60 × 60 × 11 mm form factor and a power density of 2.5 kW/in³.

The second design converts 800 V DC directly to 12 V using an ISOP half-bridge LLC topology and a matrix transformer. It delivers 6 kW total design power and supports peak loads up to 10.8 kW, achieving a height of just 8 mm within a 130 × 40 mm footprint. The design reaches up to 98.2 percent peak efficiency and 97.1 percent efficiency at full load, with a power density exceeding 2300 W/in³. It combines 650 V CoolGaN and 40 V OptiMOS™ 7 switches along with EiceDRIVER gate drivers and a PSOC microcontroller.

The reference designs are part of Infineon’s broader AI power portfolio, covering the full power delivery chain from grid to core, including solid-state transformers, circuit protection, high-voltage conversion and point-of-load power modules. By leveraging silicon, silicon carbide and gallium nitride technologies, Infineon aims to provide scalable, high-efficiency solutions for next-generation AI server platforms.

Original – Infineon Technologies