Alpha and Omega Semiconductor announced it will showcase its latest power management solutions for AI computing, data centers and industrial applications at the Applied Power Electronics Conference (APEC). The company will present a range of new products designed to address increasing power demands in AI core computing, AI factory infrastructure and industrial power systems.

For AI core power applications, AOS introduced two new controllers targeting high-performance GPUs and system-on-chip processors used in graphics cards and AI data centers. The AOZ73216QI is a 16-phase, 2-rail controller based on the company’s proprietary AOS Advanced Transient Modulator control scheme and supports the OpenVReg16 specification. The AOZ73104QI is a 4-phase controller compliant with OVR4-22 and is designed to safely manage GPU power to maintain performance.

The company also released the AOZ71049QI, AOZ71149QI and AOZ71146QI controllers designed to power Intel IMVP9.3 Panther Lake and Wild Cat Lake CPUs. These devices support configurations of up to 9 phases and 4 rails and are currently in mass production for several OEM and ODM AI notebook platforms.

AOS also introduced the AOZ52986QI Smart Power Stage in a compact QFN3x4 package compliant with Intel’s common footprint specification. The device offers improved efficiency and thermal performance compared with conventional smart power stage solutions. In addition, the AOZ53228QI DrMOS product family provides accurate NCP and OCP protection, longer peak current capability and improved tolerance to current imbalance conditions, targeting GPU and SoC power applications in AI computing systems.

The AOZ13058DI Type-C sink and AOZ15953DI Type-C source protection switches support USB Type-C EPR 3.1 extended power levels up to 240 W. The AOZ13058DI includes overvoltage and overcurrent protection for 48 V sink applications, while the AOZ15953DI provides protection features for Type-C source implementations.

For AI factory infrastructure and data center power systems, AOS highlighted MOSFET solutions designed for high-power-density DC-DC intermediate bus converters used in AI servers. These include the AONC40202 and AONC68816 devices in DFN3.3×3.3 packages with source-down configuration, as well as the AONA66642 and AONA68815 devices in DFN5×6 drain-down packages designed to meet strict thermal requirements.

The company is also showcasing its αSiC and GaN wide bandgap solutions designed for high-voltage, high-frequency operation in AI data center power architectures with 800 V DC distribution. For AC-DC conversion, the third-generation AOM020V120X3 αSiC MOSFET and topside-cooled AOGT020V120X2Q devices provide high-voltage performance with low conduction and switching losses. These devices support applications ranging from power sidecar configurations to direct conversion from a 13.8 kV AC grid input to 800 V DC.

For high-density DC-DC conversion inside server racks, AOS GaN FET products such as the topside-cooled 650 V AOGT035V65GA1 and the 100 V AOFG018V10GA1 enable compact and efficient conversion from 800 V DC to lower voltages required by GPUs and AI accelerators.

The company also introduced the AOLV66935 MOSFET in an LFPAK8×8 package designed for 48 V hot-swap applications in AI servers. The device features an RDS(on) below 1.85 mΩ and a junction temperature rating of 175 °C to meet high safe operating area requirements.

For industrial power applications, AOS presented solutions supporting brushless DC motor systems. The portfolio includes MOSFETs, half-bridge and three-phase motor driver ICs, and dual-core motor control microcontrollers. The GTPAK package provides topside cooling through a large exposed pad designed to transfer heat directly to a heatsink instead of the PCB, improving thermal performance in motor drive applications.

The company’s motor driver ICs integrate features such as bootstrap diodes, adjustable dead-time control, sleep modes and multiple protection functions. AOS also offers dual-core motor control MCUs including the AOZ6812QI and AOZ6816QI, which combine an 8051 core for system control with a motor control engine integrating field-oriented control, PID control and SVPWM modules.

At the conference, AOS will also present an exhibitor session titled “Simplified Thermal Modeling for Power MOSFETs,” scheduled for March 25.

Original – Alpha and Omega Semiconductor