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ROHM announced the start of online sales for new silicon carbide molded modules, including the TRCDRIVE pack™, HSDIP20 and DOT-247 series. The new modules are designed to promote wider adoption of high-efficiency SiC-based power conversion technologies as global demand for energy-efficient power systems continues to grow.
The products are available for online purchase through distributors such as DigiKey and Farnell.
The TRCDRIVE pack™ is a 2-in-1 SiC molded module designed for traction inverters in electric vehicles with power levels up to 300 kW. It integrates ROHM’s fourth-generation SiC MOSFETs with low on-resistance, enabling approximately 1.5× higher power density compared with conventional SiC molded modules. The module also features a terminal layout that allows the gate driver board to be connected from the top, simplifying assembly and reducing installation time. Example applications include xEV traction inverters.
The HSDIP20 module is available in 4-in-1 and 6-in-1 configurations and targets applications such as xEV onboard chargers, EV charging stations, server power supplies and AC servo systems. The lineup includes six models rated at 750 V and seven models rated at 1200 V. The modules integrate the essential power conversion circuits into a compact package, reducing design complexity and enabling smaller power conversion systems.
The DOT-247 module is a 2-in-1 SiC module designed primarily for industrial applications such as photovoltaic inverters and uninterruptible power supply systems. It retains the versatility of the widely used TO-247 package while delivering higher power density. The module supports both half-bridge and common-source circuit configurations and helps reduce component count and PCB area in power conversion circuits.
Applications for the new SiC modules include electric vehicle systems such as onboard chargers, DC-DC converters and electric compressors, as well as industrial equipment including EV charging stations, V2X systems, PV inverters, power conditioners and AI data center power systems.
Original – ROHM
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Wolfspeed announced the appointment of Daihui Yu as regional president for Greater China, effective March 16, 2026. In this role, Yu will lead the company’s business expansion across mainland China, Hong Kong and Taiwan, with responsibility for driving regional sales growth and strengthening Wolfspeed’s brand presence.
Yu holds a degree in electrical engineering from Wuhan University of Technology and an MBA from Tsinghua University.
Before joining Wolfspeed, Yu spent more than 12 years at Infineon Technologies, most recently serving as senior vice president and head of the infrastructure and industry business for Greater China, where he led regional sales and marketing activities. Prior to that, he worked for 15 years at Schneider Electric in various sales and marketing management roles across multiple industries. Earlier in his career, he served as a control systems R&D engineer at the China Academy of Space Technology.
As regional president, Yu will assume full commercial responsibility for Wolfspeed’s operations in Greater China and will lead the development and implementation of go-to-market strategies aligned with the company’s global objectives.
CEO Robert Feurle welcomed the appointment, noting that Yu’s strategic vision, operational experience and customer-focused leadership will be important for Wolfspeed’s continued growth in the region.
The company stated that the appointment supports its ongoing efforts to strengthen its presence in the Greater China market and improve collaboration across regional supply chains.
Original – Wolfspeed
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Axcelis Technologies announced that David Ryzhik, Senior Vice President of Investor Relations and Corporate Strategy, has been appointed Interim Chief Financial Officer effective March 12. The appointment follows the departure of James Coogan, who is leaving the company to pursue a CFO role at another public company in a different industry. Coogan will remain with Axcelis through April 24 to support the transition. The company has initiated a search for a permanent CFO with the help of an executive search firm.
President and CEO Russell Low said the company is confident in Ryzhik’s ability to lead the finance organization during the transition, noting his deep knowledge of Axcelis’ business strategy, financial operations and investor relations activities. Low also highlighted Ryzhik’s involvement in the company’s pending merger with Veeco Instruments and his relationships with financial stakeholders.
Ryzhik said he is honored to assume the interim CFO position and will continue working with the leadership team to execute the company’s strategy, advance integration planning related to the Veeco merger and focus on long-term shareholder value creation.
Low also thanked outgoing CFO James Coogan for his contributions to the company, noting that during his tenure he helped strengthen the finance organization and support the company’s operational discipline and strategic positioning.
Ryzhik has more than 20 years of experience in finance and investor relations. He joined Axcelis in July 2024 as Senior Vice President of Investor Relations and Corporate Strategy. Previously, he served as Vice President of Investor Relations at MKS Instruments and earlier worked as a senior equity research analyst at Susquehanna International Group and as a senior research associate at Brean Capital. Earlier in his career he held financial roles with the New York City Mayor’s Office of Management and Budget and the New York City Fire Department.
Ryzhik holds an MBA in Financial Management and a Bachelor of Business Administration in Finance and Accounting from Pace University Lubin School of Business and serves as a board member of the Boston chapter of the National Investor Relations Institute.
Original – Axcelis Technologies
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Alpha and Omega Semiconductor announced it will showcase its latest power management solutions for AI computing, data centers and industrial applications at the Applied Power Electronics Conference (APEC). The company will present a range of new products designed to address increasing power demands in AI core computing, AI factory infrastructure and industrial power systems.
For AI core power applications, AOS introduced two new controllers targeting high-performance GPUs and system-on-chip processors used in graphics cards and AI data centers. The AOZ73216QI is a 16-phase, 2-rail controller based on the company’s proprietary AOS Advanced Transient Modulator control scheme and supports the OpenVReg16 specification. The AOZ73104QI is a 4-phase controller compliant with OVR4-22 and is designed to safely manage GPU power to maintain performance.
The company also released the AOZ71049QI, AOZ71149QI and AOZ71146QI controllers designed to power Intel IMVP9.3 Panther Lake and Wild Cat Lake CPUs. These devices support configurations of up to 9 phases and 4 rails and are currently in mass production for several OEM and ODM AI notebook platforms.
AOS also introduced the AOZ52986QI Smart Power Stage in a compact QFN3x4 package compliant with Intel’s common footprint specification. The device offers improved efficiency and thermal performance compared with conventional smart power stage solutions. In addition, the AOZ53228QI DrMOS product family provides accurate NCP and OCP protection, longer peak current capability and improved tolerance to current imbalance conditions, targeting GPU and SoC power applications in AI computing systems.
The AOZ13058DI Type-C sink and AOZ15953DI Type-C source protection switches support USB Type-C EPR 3.1 extended power levels up to 240 W. The AOZ13058DI includes overvoltage and overcurrent protection for 48 V sink applications, while the AOZ15953DI provides protection features for Type-C source implementations.
For AI factory infrastructure and data center power systems, AOS highlighted MOSFET solutions designed for high-power-density DC-DC intermediate bus converters used in AI servers. These include the AONC40202 and AONC68816 devices in DFN3.3×3.3 packages with source-down configuration, as well as the AONA66642 and AONA68815 devices in DFN5×6 drain-down packages designed to meet strict thermal requirements.
The company is also showcasing its αSiC and GaN wide bandgap solutions designed for high-voltage, high-frequency operation in AI data center power architectures with 800 V DC distribution. For AC-DC conversion, the third-generation AOM020V120X3 αSiC MOSFET and topside-cooled AOGT020V120X2Q devices provide high-voltage performance with low conduction and switching losses. These devices support applications ranging from power sidecar configurations to direct conversion from a 13.8 kV AC grid input to 800 V DC.
For high-density DC-DC conversion inside server racks, AOS GaN FET products such as the topside-cooled 650 V AOGT035V65GA1 and the 100 V AOFG018V10GA1 enable compact and efficient conversion from 800 V DC to lower voltages required by GPUs and AI accelerators.
The company also introduced the AOLV66935 MOSFET in an LFPAK8×8 package designed for 48 V hot-swap applications in AI servers. The device features an RDS(on) below 1.85 mΩ and a junction temperature rating of 175 °C to meet high safe operating area requirements.
For industrial power applications, AOS presented solutions supporting brushless DC motor systems. The portfolio includes MOSFETs, half-bridge and three-phase motor driver ICs, and dual-core motor control microcontrollers. The GTPAK package provides topside cooling through a large exposed pad designed to transfer heat directly to a heatsink instead of the PCB, improving thermal performance in motor drive applications.
The company’s motor driver ICs integrate features such as bootstrap diodes, adjustable dead-time control, sleep modes and multiple protection functions. AOS also offers dual-core motor control MCUs including the AOZ6812QI and AOZ6816QI, which combine an 8051 core for system control with a motor control engine integrating field-oriented control, PID control and SVPWM modules.
At the conference, AOS will also present an exhibitor session titled “Simplified Thermal Modeling for Power MOSFETs,” scheduled for March 25.
Original – Alpha and Omega Semiconductor
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Siltronic AG confirmed its preliminary results for the 2025 financial year, reporting revenue of €1,346.7 million compared with €1,412.8 million in 2024. EBITDA reached €316.9 million, corresponding to a margin of 23.5 %, down from €363.8 million and 25.8 % in the previous year.
Wafer area sold increased during 2025 as end markets gained momentum, exceeding the level recorded in the previous year. However, several factors negatively affected revenue, including the depreciation of the U.S. dollar, price effects outside long-term agreements, and elevated inventories—particularly among customers using 200 mm wafers. The shutdown of the SD production line during 2025 also contributed to lower sales compared with 2024. When adjusted for exchange-rate effects and the SD shutdown, sales were roughly in line with the previous year.
CEO Michael Heckmeier stated that cost-control and cash-management measures were critical to achieving the company’s targets. While demand related to artificial intelligence created additional momentum, high inventories in the power semiconductor segment and the weak U.S. dollar weighed on performance. He noted that long-term industry trends such as digitalization, artificial intelligence and electromobility continue to support semiconductor capacity expansion.
Cost of sales increased to €1,235.5 million, up €98.1 million from the previous year. The increase was mainly due to higher wafer volumes and rising depreciation expenses, which reached €343.3 million as depreciation began for parts of the company’s new Singapore fabrication facility in August 2025. As a result, the gross margin declined to 8.3 % from 19.5 % in 2024.
EBITDA declined 12.9 % year over year to €316.9 million. Earnings before interest and taxes fell significantly to €-26.4 million, compared with €125.2 million in 2024, primarily due to lower EBITDA and higher depreciation. Net income for the year was €-77.9 million, with earnings per share of €-2.31 compared with €2.10 in the previous year.
Capital expenditure in 2025 totaled €369.1 million, focused mainly on the new Singapore facility. Net cash flow remained negative at €-85.3 million but improved compared with €-297 million in 2024 due to reduced investment spending.
As of December 31, 2025, total assets stood at €4,760.9 million, down from €5,084.4 million in 2024. The equity ratio remained stable at 42.6 %, while net financial debt increased to €836.5 million from €733.5 million the year before. Due to the negative earnings result, the company does not plan to distribute a dividend for the 2025 financial year.
For 2026, Siltronic expects a challenging market environment shaped by exchange-rate effects, continued price pressure outside long-term agreements, and high inventories in the 200 mm wafer segment. Based on an assumed EUR/USD exchange rate of 1.18, the company forecasts sales in the mid single-digit % range below the 2025 level and expects the EBITDA margin to fall within a range of 20 % to 24 %. Scheduled depreciation is projected to rise significantly to between €490 million and €520 million due to continued investments in 300 mm wafer capacity.
Capital expenditure is expected to decline substantially to between €180 million and €220 million in 2026, although net cash flow is likely to remain negative and roughly in line with the €-85 million recorded in 2025.
Original – Siltronic
