DISCO Corporation announced that cumulative shipments of its laser saw systems have exceeded 4,000 units as of February 2026, marking a major milestone for the company’s laser-based semiconductor processing technology.
DISCO first introduced its laser saw in 2002. It took 18 years to reach 2,000 cumulative shipments in 2020, but shipment growth has accelerated significantly since then. The company shipped an additional 2,000 units in just six years, reflecting strong demand driven by expanding semiconductor applications.
Traditionally, semiconductor wafer dicing has relied on blade dicing since the 1970s. However, as devices have become more advanced, manufacturers increasingly require low-damage, high-precision processing techniques, especially for:
- High-performance logic devices
- High-density memory products
Laser saw technology is increasingly used alongside blade processing in several advanced manufacturing steps, including:
- Grooving processes that protect fragile low-k dielectric films
- Stealth Dicing Before Grinding (SDBG) used in ultra-thin memory devices
Laser processing technologies are also becoming essential in new semiconductor materials. DISCO highlighted the adoption of its KABRA technology, which uses lasers to slice ingots, particularly in:
- Silicon carbide (SiC) wafer manufacturing
- Emerging materials such as gallium nitride (GaN) and diamond
The company noted that demand for advanced semiconductors continues to rise, particularly due to generative AI, which is driving investment in:
- High-performance logic chips
- High-bandwidth memory (HBM)
- Power semiconductor devices
DISCO said it will continue advancing its laser processing technologies to support higher precision and improved manufacturing efficiency across next-generation semiconductor production.
Original – DISCO