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SemiQ Inc. has signed a distribution agreement with NAC Semi (NAC Group, Inc.), a global electronic component design services and distribution company.
The partnership is aimed at accelerating adoption of SemiQ’s SiC technology across North American markets, giving engineers more direct access to SemiQ’s power modules, MOSFETs and Schottky diodes, along with application-focused support.
Electrification trends in industrial and automotive systems, combined with rising efficiency requirements in data centers and other high-power segments, are driving increased demand for SiC-based power electronics. SemiQ said its rugged, reliable portfolio aligns well with NAC Semi’s focus areas including power conversion, EV platforms and industrial electrification.
“Partnering with NAC Semi significantly strengthens our ability to support our global customer base as they design next-generation power systems,” said Timothy Han, President of SemiQ. “NAC’s deep technical expertise, FAE support, and focus on demand creation align perfectly with SemiQ’s high-performance, reliable silicon carbide technologies for electrification, energy efficiency, and high-voltage applications.”
NAC Semi positions itself between catalog distributors and large fulfillment players by emphasizing demand-creation services, including dedicated Field Applications Engineer (FAE) support. By adding SemiQ to its line card, NAC Semi expands its ability to support SiC designs across applications such as EV charging stations, solar inverters and high-voltage power supplies.
“SemiQ’s reputation for high-quality, reliable SiC devices perfectly complements our existing power semiconductor offerings,” said Channing Applegarth, Vice President at NAC Semi. “Adding these MOSFETs and modules to our line card gives our customers a more complete SiC solution to accelerate innovation in these vital and fast-growing high-power markets.”
Original – SemiQ
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Siltronic AG has issued its financial guidance for 2026 via an ad hoc announcement, warning of another challenging year marked by exchange rate headwinds and continued price pressure outside existing long-term agreements.
The Executive Board expects sales in 2026 to decline in the mid-single-digit % range compared with the preliminary 2025 figure of €1,347 million, with a subdued start to the year. The outlook is based on an assumed EUR/USD exchange rate of 1.18, compared with 1.13 in 2025.
On a comparable basis — excluding exchange rate effects and the closure of the SD line — revenue is expected to be roughly in line with the previous year.
While demand for 300 mm wafers is supported by AI-driven end markets, Siltronic anticipates a decline in 200 mm wafers due to intensified inventory reduction by customers in the power segment. Additionally, the full-year impact of the SD line closure will weigh on 2026 results for the first time.
“2026 will still be a challenging year, even though AI-driven end markets are clearly supporting our 300 mm volume,” said CEO Dr. Michael Heckmeier. He noted that positive developments in the memory segment have not yet fully translated into wafer demand, as customers remain capacity-constrained and inventory dynamics continue to affect downstream markets such as smartphones and PCs.
Siltronic expects its EBITDA margin to range between 20% and 24%, compared with a preliminary 23.5% in 2025.
Depreciation is projected to increase significantly in 2026 due to prior investments in the 300 mm business, reaching between €490 million and €520 million. As a result, EBIT is expected to be significantly below the 2025 preliminary figure of -€26 million.
Capital expenditures will be substantially reduced to between €180 million and €220 million, down from €369 million in 2025. However, as capex-related payments will exceed this level, net cash flow is expected to remain around the prior year’s preliminary figure of -€85 million.
Siltronic will publish its full audited Annual Report for 2025 on March 12, 2026.
Original – Siltronic
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Applied Materials, Inc. reported results for its first quarter ended January 25, 2026, highlighting strong performance driven by accelerating investments in AI computing and advanced semiconductor technologies.
Applied generated revenue of $7.01 billion in the quarter. On a GAAP basis, the company reported:
- Gross margin of 49.0%
- Operating income of $1.83 billion, representing 26.1% of net revenue
- Earnings per share (EPS) of $2.54
On a non-GAAP basis, results included:
- Gross margin of 49.1%
- Operating income of $2.11 billion, or 30.0% of net revenue
- EPS of $2.38
The company generated $1.69 billion in cash from operations and returned $702 million to shareholders, including $337 million in share repurchases and $365 million in dividends.
“Applied Materials delivered strong results in our fiscal first quarter, fueled by the acceleration of industry investments in AI computing,” said Gary Dickerson, President and CEO. “The need for higher performance and more energy-efficient chips is driving high growth rates for leading-edge logic, high-bandwidth memory and advanced packaging. These are areas where Applied is the process equipment leader, and we expect to grow our semiconductor equipment business over 20% this calendar year.”
Brice Hill, Senior Vice President and CFO, added that the company has nearly doubled its system manufacturing capability in recent years, strengthened its supply chain and increased inventories to support anticipated market growth.
Compared with Q1 FY2025, revenue declined 2% year-on-year to $7.01 billion, while gross margin improved slightly to 49.0%. GAAP net income rose 71% to $2.03 billion, with diluted EPS increasing 75% to $2.54.
On a non-GAAP basis, gross margin increased to 49.1%, operating margin was 30.0%, and diluted EPS remained flat at $2.38. Non-GAAP free cash flow rose 91% year-on-year to $1.04 billion.
During the quarter, Applied announced several strategic and technology milestones:
- Samsung Electronics will join Applied’s new EPIC Center in Silicon Valley, aimed at accelerating commercialization of breakthrough semiconductor technologies.
- Introduced new deposition, etch and materials modification systems to enhance energy-efficient performance of Gate-All-Around (GAA) transistors at 2nm and beyond, including:
- Viva™, a radical treatment system to smooth GAA silicon nanosheets with atomic precision.
- Sym3™ Z Magnum™, a conductor etch system enabling angstrom-level 3D trench profile control.
- Spectral™, an atomic layer deposition system replacing tungsten contacts with molybdenum to reduce electrical resistance.
- Received 2025 TSMC Excellent Performance Awards for technology development, production support and green manufacturing.
- Recognized by Micron Technology with a 2025 Outstanding Performance in Sustainability Award.
Applied said demand for leading-edge logic, high-bandwidth memory and advanced packaging continues to strengthen, positioning the company to benefit from ongoing AI-driven semiconductor investment.
Original – Applied Materials
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Okmetic has entered volume production at its expanded Vantaa fab in Finland. The site focuses on 150–200 mm silicon and bonded silicon-on-insulator (SOI) wafers, with the expansion significantly increasing 200 mm polished wafer capacity.
“With this expansion, Okmetic strengthens its position as an EU-based, one-stop supplier for 150 to 200 mm silicon wafer platforms serving the MEMS, sensor, RF, and Power markets. The increase in 200 mm polished wafer capacity strengthens long-term supply stability for critical semiconductor applications,” said President and CEO Kai Seikku.
Okmetic produced the first wafers from the expanded fab in June 2025, launching a structured qualification and ramp phase. With volume production now underway in early 2026, the company has started delivering wafers from the expanded capacity to customers, supporting long-term supply readiness across MEMS, RF, Power and GaN-based applications.
The Vantaa expansion is part of Okmetic’s broader plan to more than double capacity by 2030. Construction began in early 2023 and adds more than 40,000 m², including a 6,000 m² cleanroom as well as new crystal growth and wafering areas. Okmetic said the fab upgrade incorporates state-of-the-art equipment with a focus on energy efficiency.
The latest investment builds on prior capacity additions, including the doubling of bonded SOI production capacity between 2017 and 2021 and the introduction of a patterning line for Cavity SOI (C-SOI®) production in 2019. By expanding 200 mm polished wafer output, Okmetic aims to better meet evolving industry demand while reinforcing Europe-based supply of 150–200 mm wafer platforms.
Original – Okmetic
