DISCO CORPORATION announced two advancements to support wafer thinning and post-thinning quality at scale: the DFG8561, a fully automatic grinder supporting Φ300 mm wafers, and DP26, a new dry polishing wheel series engineered for small-die devices. Both will be exhibited at SEMICON Japan 2025 (December 17–19, Tokyo Big Sight).
Developed to address accelerating migration from 5-/6-inch to 8-inch and 300 mm wafers for automotive and home-appliance MCUs, analog ICs and sensors, the DFG8561 targets higher throughput, tighter thickness control and broader material compatibility. Key enhancements include a low-vibration, low-thermal-expansion rotation axis on the wafer retaining table to improve within-wafer and wafer-to-wafer thickness accuracy; a high-power 6.3 kW spindle for difficult-to-grind materials such as SiC and sapphire; and optimized transfer/cleaning that reduces processing time, delivering 1.6× productivity versus the conventional model. A built-in vacuum unit cuts footprint by 12%, boosting output per unit floor area. Usability upgrades enable recipe configuration per wafer within the same cassette for multi-variety, low-volume production, with main data types visualized as graphs on a 19-inch monitor.
Complementing the grinder, DP26 dry polishing wheels are designed to remove post-DBG damage on small-die wafers in memory and RFID-class applications where further thinning and high mechanical strength are critical. Using an improved pad design and materials, DP26 achieves stable processing of approximately 1 mm × 1 mm small die while maintaining post-process die strength, and delivers a more stable removal amount during polishing compared with the conventional product—contributing to reduced TTV within the wafer.
Together, DFG8561 and DP26 provide an integrated approach from high-accuracy 300 mm grinding to damage-mitigating dry polishing for small-die devices, supporting higher productivity, tighter process control and robust device strength across advanced back-end manufacturing and OSAT environments.
Original – DISCO