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VisIC Technologies announced the successful second closing of its Round B funding, securing $26 million to advance GaN power semiconductor technology for electric vehicles. The round was led by a global semiconductor leader, with Hyundai Motor Company and Kia joining as a strategic investor. The milestone strengthens VisIC’s position in high-performance GaN power devices for automotive traction inverters and next-generation mobility.
The global EV market is pushing for higher efficiency, longer driving range, and more sustainable power electronics. Traditional silicon is reaching its limits, and while SiC offers performance advantages, cost remains a barrier for mass adoption. VisIC’s D³GaN™ platform targets both 400 V and 800 V EV architectures, enabling lighter, smaller, and more energy-efficient traction inverters with scalability and reliability.
The new funding will accelerate key programs:
- Optimization, qualification, and release of Gen3 750 V GaN dice and power modules
- Development of Gen4 1350 V GaN technology to cover the full spectrum of EV designs
- Supply-chain stabilization and ramp-up of GaN deliveries for traction inverters
- Expansion of GaN solutions for emerging 800 V data-center power applications
“This investment marks a major milestone for VisIC and the global EV industry. Our D³GaN technology is redefining power electronics for electric vehicles, and the support of our strategic partners accelerates our mission to deliver high-efficiency, scalable solutions for the next generation of mobility,” said Tamara Baksht, CEO of VisIC Technologies.
“Hyundai Motor Company and Kia are committed to advancing sustainable mobility. Partnering with VisIC enables us to integrate cutting-edge GaN technologies into our EV platforms, enhancing efficiency, reliability, and performance as we shape the future of electric transportation,” said Hyundai Motor Company and Kia.
Original – VisIC Technologies
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The European Investment Bank (EIB) and STMicroelectronics have signed a €500 million financing agreement to support Europe’s competitiveness and strategic autonomy. This is the first tranche of a broader €1 billion credit line recently approved by the EIB for ST, a leading semiconductor manufacturer with a strong European footprint in Italy, France and Malta serving automotive, industrial, personal electronics and communication infrastructure markets.
The new financing will back ST’s investments in innovative semiconductor technologies and devices across Italy and France, spanning both research and development and high-volume manufacturing. Approximately 60% of the funding will support manufacturing capabilities at key sites including Catania, Agrate and Crolles, with the remaining 40% directed to R&D. Since 1994, the EIB has supported nine ST projects totaling about €4.2 billion.
“Europe’s ability to lead in semiconductor innovation is vital for our competitiveness, resilience and climate goals. This agreement reflects the EIB’s commitment to supporting strategic industries that enable the green and digital transitions and strengthen Europe’s technological sovereignty,” said Gelsomina Vigliotti, EIB Vice-President.
“ST continues to be committed to strengthening Europe’s semiconductor ecosystem, and this significant loan from EIB aims at bolstering our efforts in R&D for differentiated technologies and high-volume manufacturing across our sites in Italy and France,” said Jean-Marc Chery, President and CEO of STMicroelectronics. “ST’s longstanding collaboration with the EIB underscores our commitment to ensuring European technology leadership in the global semiconductor market.”
“Semiconductors are at the heart of modern economies, powering everything from electric vehicles to digital infrastructure. By financing ST’s investments in research and advanced manufacturing, we are helping Europe secure critical technologies and create high-skilled jobs for the future,” added Ambroise Fayolle, EIB Vice-President.
The announcement follows last week’s visit by an EIB delegation led by Vice-Presidents Gelsomina Vigliotti and Ambroise Fayolle to ST’s Catania facility, a state-of-the-art site covering the full Silicon Carbide (SiC) value chain and a key element of the Bank’s financing focus.
Original – STMicroelectronics
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Infineon Technologies AG announced that all of its global operations are now powered by 100% green electricity—an important milestone on the company’s path to carbon neutrality by 2030. Infineon has also surpassed its 2025 interim target for Scope 1 and 2 emissions, achieving a reduction of more than 80% versus the 2019 base year, while doubling revenue over the same period. Earlier this year in May, the Science Based Targets initiative (SBTi) validated the company’s science-based targets.
“Infineon semiconductors help societies decarbonize while meeting the growing energy demands of modern life,” said Elke Reichart, Member of the Management Board of Infineon and Chief Digital and Sustainability Officer. “We at Infineon continue to decarbonize our own value creation. We are proud that all Infineon locations globally are now running on 100% green electricity.”
The transition builds on a multi-year program to cut CO2 emissions and improve resource efficiency in manufacturing. Infineon converted its European sites to 100% green electricity in 2021, followed by North America in 2022. Major manufacturing sites in Malaysia, Kulim and Melaka, transitioned in 2023. During 2024 and 2025, remaining production locations in China, Indonesia and Singapore completed the shift, alongside all Research, Development, Sales and Marketing sites worldwide.
Infineon’s achievement aligns with the RE100 standard, reflecting its commitment to long-term renewable sourcing. This year, the company signed long-term Power Purchase Agreements for wind and solar in Germany and Spain. On-site photovoltaic installations are being added in Kulim and Melaka, while facilities in Warstein, Regensburg, Villach, Wuxi and Singapore have been generating solar power for some time.
In parallel, Infineon is expanding silicon carbide (SiC) production in Dresden (Germany) and Kulim (Malaysia) to support the global build-out of sustainable power. Its semiconductor innovation underpins energy generation from solar and wind, grid stabilization and the efficient, reliable powering of Artificial Intelligence. To advance state-of-the-art sustainable manufacturing, the company is deploying the latest greenhouse gas abatement systems and highly efficient equipment in addition to sourcing renewable energy.
Original – Infineon Technologies
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Siemens and GlobalFoundries have formed a new strategic collaboration to combine complementary AI-driven capabilities that enhance semiconductor manufacturing and adjacent advanced industries, targeting gains in efficiency, security and reliability. Under a new memorandum of understanding, the companies will focus on fab automation, electrification, and digital solutions and software spanning chip development through product lifecycle management.
A central element of the collaboration is the deployment of AI-enabled software, sensors and real-time control systems in fab automation to address rising demand for reliable semiconductors and autonomous platforms. By leveraging centralized automation and predictive maintenance, Siemens and GF aim to increase equipment availability and operational efficiency in chip production, with solutions designed to scale across other advanced industries. The partners intend to develop and deploy these capabilities within their own operations to deliver enhanced offerings.
The expanded relationship comes amid unprecedented demand for essential semiconductors and autonomous platforms in artificial intelligence, defense, energy and connectivity. By teaming up, Siemens and GF plan to accelerate growth, strengthen security and reliability, and extend their impact across the ecosystem.
“Our economy runs on Silicon—one wafer at a time. Chips are critical for applications like robotics or connectivity and for bringing AI into the physical world and industry. We are collaborating to make global semiconductor supply chains more resilient and to enable efficient localized manufacturing around the world,” said Cedrik Neike, Member of the Managing Board of Siemens AG and CEO Digital Industries.
“Secure, locally manufactured semiconductors are at the core of the AI transition—from cloud to the physical world, bringing intelligence into devices we use every day and enabling applications we couldn’t imagine a few years ago,” said Tim Breen, CEO of GlobalFoundries. “Our unique collaboration with Siemens allows us to go faster—to build the technologies that make this possible—differentiated, energy-efficient, connected and secure chips across a wide range of next-generation applications.”
Siemens brings a comprehensive portfolio of industrial, energy and building automation and digitalization technologies, including advanced software for chip design and manufacturing, fab automation and product lifecycle management. Using these solutions, the companies will enable collaboration across the semiconductor lifecycle and deliver high-performance, reliable devices at scale.
GF, together with MIPS, a GF company and global leader in RISC-V processor IP, contributes process technology and design capabilities to accelerate tailored solutions that support Siemens’ goal of enabling autonomous platforms and physical AI chips at scale. The publicly listed U.S. company operates manufacturing facilities in the USA, Asia and Europe, including Europe’s largest semiconductor production site in Dresden with approximately 3,000 employees.
Original – GlobalFoundries
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Wise Integration, Powernet and KEC have signed a strategic memorandum of understanding to co-develop next-generation switched-mode power supply (SMPS) solutions tailored for AI server applications in South Korea. The collaboration supports the country’s broader push to scale AI infrastructure and deploy higher-density data centers.
Under the agreement, Wise Integration will provide GaN power devices, digital-control know-how and technical support. Powernet Technologies Corporation will lead new SMPS designs built on Wise’s WiseGan® and WiseWare® technologies. KEC Corporation will oversee backend manufacturing, including module integration and system-in-package production optimized for the thermal and reliability demands of AI-server racks.
The partners expect the program to accelerate competitive AI-server power supply designs, create new business opportunities in Korea’s AI-server market and shorten time-to-market by leveraging WiseGan® and WiseWare®. The initiative extends an earlier Wise Integration–Powernet collaboration focused on compact, digitally controlled power supplies for faster, smaller and more energy-efficient equipment.
AI servers require high power, generate significant heat and depend on SMPS architectures that convert high-voltage inputs (such as 400 V) to stable 48 V rails with minimal loss. GaN devices paired with digital control enable higher switching frequencies, improved efficiency and tighter management of fast, high-current load transients—attributes well suited to these workloads.
The effort aligns with South Korea’s investments in AI-dedicated data centers, including high-performance GPU clusters and digital infrastructure that demand more efficient, compact and scalable power-conversion systems. “Korea is moving quickly to build the next generation of AI data centers, and power architecture is a critical piece of that effort. Working with Powernet and KEC lets us bring GaN-based digital control into server-grade designs at scale—delivering the efficiency, thermal performance, and responsiveness that modern AI hardware depends on,” said Ghislain Kaiser, CEO of Wise Integration.
Beyond the MoU, Wise Integration continues to broaden its GaN plus digital-control platform to support partners as switching frequencies rise, thermal budgets tighten and efficiency targets become more aggressive. The company recently introduced WiseWare® 1.0 for totem-pole PFC and LLC topologies, a fully digital controller that, while aimed today at gaming, displays and industrial systems, shares the same architecture—high-frequency GaN operation, compact form factor and digitally managed efficiency—that naturally extends to server-class designs envisioned under this Korea-focused collaboration.
Original – Wise Integration
