Micro Commercial Components (MCC) has introduced the MCTT1D7N10Y, a 100V power MOSFET housed in a TO-Leaded Topside Cooling (TOLT) package, engineered to deliver exceptional thermal performance and rugged reliability. Designed for space-constrained, high-demand environments such as industrial systems and server-grade power electronics, the MCTT1D7N10Y combines high current capability with advanced thermal management.
Topside cooling is a thermal architecture that allows heat to be dissipated directly from the top of the package. Unlike conventional bottom-cooled designs that rely on the printed circuit board (PCB) for heat transfer, the TOLT package features an exposed drain pad on the top surface, enabling direct thermal contact with a heatsink, cold plate, or thermal interface material (TIM). This approach significantly shortens the thermal path, resulting in more efficient heat dissipation and enhanced device performance.
By removing the PCB from the primary thermal path, topside cooling enables lower junction temperatures, greater current handling with minimal derating, simplified PCB layouts, and extended system longevity through reduced thermal stress on adjacent components.
Key features of the MCTT1D7N10Y include:
- 100V N-channel MOSFET with maximum RDS(on) of 1.7 mΩ
- TO-Leaded Topside Cooling (TOLT) package with exposed drain for efficient heat transfer
- Direct die-to-heatsink thermal path bypassing the PCB
- Junction-to-case thermal resistance (RthJC) of 0.36 K/W
- Low-profile package suited for compact designs
- High current capability with strong thermal cycling robustness
With its combination of electrical performance and advanced packaging, the MCTT1D7N10Y offers an ideal solution for designers seeking to enhance power density, efficiency, and reliability in next-generation industrial and data-centric power applications.
Original – Micro Commercial Components