• onsemi Introduces Vertical GaN Power Devices, Targeting Higher Efficiency and Power Density for AI and Electrification

    onsemi Introduces Vertical GaN Power Devices, Targeting Higher Efficiency and Power Density for AI and Electrification

    2 Min Read

    onsemi announced a new family of vertical gallium nitride (vGaN) power semiconductors intended to raise efficiency, power density, and ruggedness across high-demand applications, including AI data centers, electric vehicles, renewable energy, and aerospace and defense. Developed at the company’s Syracuse, New York facility, the GaN-on-GaN technology conducts current vertically through the device to support higher operating voltages and faster switching frequencies.

    According to onsemi, the vGaN architecture can reduce conversion losses by nearly 50 percent versus current solutions while enabling smaller and lighter power systems through higher-frequency operation. The company holds more than 130 global patents related to vertical GaN covering process, device architecture, manufacturing, and systems innovations.

    Key points
    • Technology: GaN-on-GaN structure conducts current vertically, designed for high voltage and high-frequency switching
    • Efficiency: Potential to cut power losses by almost 50 percent while improving thermal performance and power density
    • Footprint: Devices are described as approximately three times smaller than commercially available lateral GaN alternatives
    • Sampling: Initial 700 V and 1,200 V devices are sampling to early access customers

    Target applications
    • AI data centers: Higher-density 800 V DC-DC stages to improve cost per rack and reduce component count
    • Electric vehicles: Smaller, lighter, and more efficient traction inverters
    • Charging infrastructure: Faster, more compact, and rugged charging systems
    • Renewable energy: Higher-voltage solar and wind inverter stages with lower losses
    • Energy storage systems: High-density, bidirectional converters for batteries and microgrids
    • Industrial automation: More efficient, cooler motor drives and robotics
    • Aerospace, defense, and security: Compact, high-reliability power platforms

    Most GaN power devices are built on non-GaN substrates such as silicon or sapphire and conduct laterally across the surface. onsemi’s vGaN uses a GaN substrate and a vertical current path, which increases voltage handling, improves thermal stability, and enhances ruggedness under extreme operating conditions. The vertical approach is aimed at enabling higher operating frequencies, shrinking passives such as inductors and capacitors, and reducing overall system size and cooling requirements.

    onsemi is currently sampling 700 V and 1,200 V vGaN devices to early access customers. Broader portfolio details and production timelines are expected to follow.

    Original – onsemi

    Comments Off on onsemi Introduces Vertical GaN Power Devices, Targeting Higher Efficiency and Power Density for AI and Electrification
  • Taiwan Semiconductor Unveils 1200 V Automotive-Grade Low-Loss Diodes for High-Power Designs

    Taiwan Semiconductor Unveils 1200 V Automotive-Grade Low-Loss Diodes for High-Power Designs

    1 Min Read

    Taiwan Semiconductor announced a new 1,200 V PLA/PLD diode series aimed at automotive and high-reliability power systems. The devices, rated at 15 A, 30 A, and 60 A, combine a low forward voltage (1.3 Vf max), low reverse leakage (<10 µA at 25 °C), and a high junction temperature rating (Tj max 175 °C) to improve efficiency and thermal headroom in demanding environments.

    The portfolio is offered in ThinDPAK, D2PAK-D, and TO-247BD packages, enabling straightforward drop-in replacement in existing layouts. Two models, PLAD15QH and PLDS30QH, are fully AEC-Q qualified for automotive use. All six devices are manufactured to stringent automotive-quality standards.

    Target applications span three-phase AC/DC converters, server and computing power systems including AI power shelves, EV charging stations and on-board chargers, Vienna rectifiers, totem-pole and bridgeless PFC topologies, inverters and UPS systems, and general-purpose high-power rectification.

    By pairing low conduction loss with controlled leakage and high temperature capability, the PLA/PLD diodes are positioned to boost efficiency, reduce thermal dissipation, and enhance reliability across both new and retrofit power designs.

    Original – Taiwan Semiconductor

    Comments Off on Taiwan Semiconductor Unveils 1200 V Automotive-Grade Low-Loss Diodes for High-Power Designs
  • Renesas Posts Solid Q3 2025 Results

    Renesas Posts Solid Q3 2025 Results

    2 Min Read

    Renesas Electronics reported third-quarter 2025 results showing stable revenue and strong profitability on a non-GAAP basis, alongside IFRS figures that reflect the impact of purchase accounting and other non-recurring items.

    Third quarter 2025 (non-GAAP)
    • Revenue: 334.2 billion yen
    • Gross profit: 192.5 billion yen (gross margin 57.6%)
    • Operating profit: 103.2 billion yen (operating margin 30.9%)
    • Profit attributable to owners of parent: 88.2 billion yen (margin 26.4%)
    • EBITDA: 122.5 billion yen (margin 36.7%)

    Third quarter 2025 (IFRS)
    • Revenue: 335.4 billion yen
    • Gross profit: 192.3 billion yen (gross margin 57.3%)
    • Operating profit: 72.6 billion yen (operating margin 21.7%)
    • Profit attributable to owners of parent: 106.3 billion yen (margin 31.7%)
    • EBITDA: 117.4 billion yen (margin 35.0%)

    Nine months ended September 30, 2025 (non-GAAP)
    • Revenue: 967.6 billion yen
    • Gross profit: 552.0 billion yen (gross margin 57.1%)
    • Operating profit: 278.9 billion yen (operating margin 28.8%)
    • Profit attributable to owners of parent: 239.3 billion yen (margin 24.7%)
    • EBITDA: 336.3 billion yen (margin 34.8%)

    Nine months ended September 30, 2025 (IFRS)
    • Revenue: 969.7 billion yen
    • Gross profit: 546.5 billion yen (gross margin 56.4%)
    • Operating profit: 133.9 billion yen (operating margin 13.8%)
    • Profit (loss) attributable to owners of parent: negative 69.1 billion yen (margin negative 7.1%)
    • EBITDA: 276.7 billion yen (margin 28.5%)

    The gap between non-GAAP and IFRS results primarily reflects amortization of purchased intangible assets and depreciation of property, plant and equipment, stock-based compensation, and other non-recurring items and adjustments. For the third quarter, these factors reduced IFRS operating profit relative to non-GAAP by 30.6 billion yen; for the nine-month period, the reduction was 145.0 billion yen. On gross profit, reconciliation impacts were modest for the quarter and nine months

    Overall, Renesas delivered resilient non-GAAP profitability with gross margins above 57% and operating margins near 31% in the third quarter, while IFRS results capture the accounting effects of one-time and acquisition-related items over the reporting periods.

    Original – Renesas Electronics

    Comments Off on Renesas Posts Solid Q3 2025 Results