Infineon Technologies announced EasyPACK™ C, the next generation of its EasyPACK power module family, targeting high-stress industrial applications including fast DC and megawatt EV charging, energy storage systems, and uninterruptible power supplies. The first devices in the new package integrate CoolSiC MOSFETs 1200 V G2 with Infineon’s .XT interconnection technology to deliver higher efficiency, stronger power-cycling performance, and longer service life under fluctuating load profiles.

According to Infineon, designs based on CoolSiC MOSFET G2 in EasyPACK C can achieve more than 30 percent higher power density and up to 20 times longer lifetime compared with prior-generation CoolSiC devices. The second-generation MOSFETs also provide an approximate 25 percent reduction in RDS(on), helping to cut conduction losses and improve thermal headroom at elevated operating currents.

The new housing concept supports higher power density and greater layout flexibility, and it is engineered with a roadmap toward future, higher-voltage classes. The inclusion of .XT interconnection is intended to further extend device lifetime by reducing thermal resistance and improving reliability under rigorous cycling.

EasyPACK C has been engineered for harsh thermal conditions. The modules withstand overload switching up to a junction temperature Tvj(over) of 200°C and support continuous operation up to Tvj(op) of 175°C, aided by a new plastic material and silicone gel system. An updated PressFIT pin design doubles current capacity per pin, lowers PCB-level temperatures, and streamlines assembly. Electrical isolation is rated at 3 kV AC for one minute.

The portfolio launches with multiple topologies, including three-level and H-bridge configurations, and is available with or without integrated thermal interface material to align with different cooling strategies and manufacturing flows.

Initial modules featuring CoolSiC MOSFET G2 in EasyPACK C are available now, with further additions planned to serve a broader range of industrial power architectures.

Original – Infineon Technologies