Infineon Technologies has enhanced its Infineon Power Simulation Platform (IPOSIM) with a SPICE-based model generation tool that elevates system-level accuracy for loss and thermal analysis. The update enables developers to include external circuitry and gate-driver selection directly in their simulations, producing more realistic results for static, dynamic, and thermal performance across a wide range of operating conditions.
By incorporating non-linear semiconductor behavior and real-world parameters such as stray inductance, gate voltage, and dead time, the new capability supports advanced device comparisons early in the design cycle. Engineers can configure the application environment within the workflow, accelerating device selection, shortening time-to-market, and reducing costly hardware iterations. The integrated approach is particularly relevant for applications where switching power and thermal performance are critical, including EV charging, solar inverters, motor drives, energy storage systems, and industrial power supplies.
The SPICE functionality is fully embedded in IPOSIM’s multi-device comparison process. Users can select supported devices, identify compatible gate drivers, and run guided simulations that reflect practical operating scenarios. Models are generated online and are designed to streamline decision-making with system-level fidelity.
IPOSIM with SPICE is available now and free to use with company registration. The initial release supports 1200 V silicon carbide discrete devices in a predefined three-phase, two-level topology, alongside 36 compatible gate drivers. Infineon plans to extend coverage to CoolMOS™, CoolSiC™ modules, OptiMOS™, and GaN devices, with broader gate-driver support to follow.
Original – Infineon Technologies