Texas Instruments (TI) has introduced a new suite of power-management technologies and design resources to address the increasing energy demands of artificial intelligence (AI) data centers. The announcement was made ahead of the Open Compute Project (OCP) Global Summit in San Jose, California, where TI will showcase its latest innovations supporting the industry’s transition from 12 V and 48 V power systems to high-efficiency 800 VDC architectures.

As AI workloads grow and IT rack power approaches the megawatt scale, TI is collaborating with NVIDIA to develop advanced power-management devices optimized for the emerging 800 VDC data center standard. These new solutions aim to deliver higher efficiency, improved power density, and scalable energy conversion for next-generation AI computing infrastructure.

Among the highlights of TI’s announcement are several key resources and reference designs:

  • White paper: “Power delivery trade-offs when preparing for the next wave of AI computing growth.” The paper explores design strategies for high-efficiency, high-density power delivery systems, emphasizing the technical benefits and challenges of adopting 800 VDC architectures.
  • 30 kW AI server power-supply reference design: A dual-stage design featuring a three-phase, three-level flying capacitor PFC converter paired with dual delta-delta three-phase LLC converters. The system can be configured for a single 800 V output or split supplies to meet demanding AI workloads.
  • Dual-phase smart power stage (CSD965203B): Delivers up to 100 A per phase and offers the highest peak power density in its class, allowing designers to scale power delivery efficiently across compact PCBs.
  • Dual-phase smart power module (CSDM65295): Provides up to 180 A of peak output current in a 9 mm × 10 mm × 5 mm package, integrating two inductors and supporting trans-inductor voltage regulation for superior thermal and electrical performance.
  • GaN intermediate bus converter (LMM104RM0): Offers up to 1.6 kW of output power with over 97.5 percent conversion efficiency in a compact quarter-brick form factor, supporting high light-load performance and active current sharing between modules.

According to Chris Suchoski, Sector General Manager for Data Centers at TI, the evolution of AI data centers requires scalable and efficient power infrastructures. “With the growth of AI, data centers are evolving from simple server rooms to highly sophisticated power infrastructure hubs,” he said. “Scalable power infrastructure and higher power efficiency are essential to meet these demands and drive future innovation. With TI devices, designers can build next-generation solutions that enable the transition to 800 VDC.”

TI’s participation at the OCP Global Summit will include live demonstrations, technical sessions, and presentations exploring advanced data center power architectures. The company continues to position itself as a key technology partner in developing efficient, reliable, and scalable power solutions that support the ongoing transformation of AI data centers worldwide.

Original – Texas Instruments