Applied Materials and Arizona State University (ASU) have officially opened the Materials-to-Fab (MTF) Center, a $270 million research, development, and prototyping facility located at ASU’s MacroTechnology Works in Tempe, Arizona. The new center aims to bridge the gap between semiconductor research and large-scale manufacturing, accelerating the transition from materials discovery to functional fabrication.
The ribbon-cutting ceremony coincided with the SEMICON West conference in nearby Phoenix and was attended by Arizona Governor Katie Hobbs, ASU President Michael Crow, and Applied Materials executives, including Dr. Prabu Raja, President of the Semiconductor Products Group.
The MTF Center will bring together researchers, industry leaders, startups, and government partners to collaborate on advanced semiconductor process technologies. Equipped with Applied Materials’ state-of-the-art tools, the facility provides a shared space for innovation and rapid prototyping across the semiconductor value chain.
ASU President Michael Crow emphasized that the collaboration will strengthen the U.S. semiconductor manufacturing ecosystem by combining the capabilities of a global technology leader with a major research university. He noted that the initiative supports national goals for technological competitiveness and security.
According to Dr. Prabu Raja, the partnership will accelerate development of new chip technologies critical for artificial intelligence, high-performance computing, and other emerging applications. He described universities as essential drivers of semiconductor innovation, highlighting ASU’s engineering expertise as key to the success of the program.
Governor Katie Hobbs praised the initiative as a major milestone for Arizona’s semiconductor sector, reinforcing the state’s growing role as a hub for advanced technology and manufacturing. The project is supported by the Arizona Commerce Authority and complements ongoing regional efforts under the federal CHIPS and Science Act, including the Southwest Advanced Prototyping (SWAP) Hub and the SHIELD USA advanced packaging initiative.
The new center builds upon Applied Materials’ existing collaboration with ASU and its broader R&D network, which includes the forthcoming EPIC Center in Silicon Valley—set to become the world’s largest semiconductor process technology research facility. ASU, with the nation’s largest engineering school and a strong focus on workforce development, continues to play a central role in strengthening America’s semiconductor ecosystem.
The Materials-to-Fab Center marks a significant step in expanding semiconductor innovation capabilities in the Southwest, providing a platform for academic and industrial partners to advance the technologies that will define the next era of microelectronics.
Original – Applied Materials