Toshiba Electronic Devices & Storage Corporation has introduced three new 650V silicon carbide (SiC) MOSFETs — TW027U65C, TW048U65C, and TW083U65C — built on its latest 3rd generation SiC chip technology. These devices are housed in compact surface-mount TOLL packages, delivering higher power density, lower losses, and easier integration for industrial and renewable energy applications.

SiC technology is at the heart of next-generation power electronics, and Toshiba’s move to a TOLL package represents a significant step forward. Compared to traditional through-hole packages (like TO-247), the new TOLL design:

  • Reduces device volume by 80%+, enabling miniaturization and higher equipment power density.
  • Lowers parasitic impedance, cutting down switching losses.
  • Supports Kelvin connection, minimizing source inductance effects and enabling faster, more efficient switching.

In benchmark testing, the TW048U65C demonstrated:

  • ~55% lower turn-on loss (Eon)
  • ~25% lower turn-off loss (Eoff)
    versus Toshiba’s earlier SiC MOSFETs in TO-247 packages. This means lower system losses and higher overall efficiency for power-hungry applications.

Toshiba is positioning these new SiC MOSFETs for a wide range of high-performance power systems, including:

  • Switched-mode power supplies for servers, data centers, and communications
  • EV charging stations
  • Photovoltaic inverters for solar energy
  • Uninterruptible power supplies (UPS)

Technical Highlights

  • 3rd-Gen Toshiba SiC MOSFETs: Optimized drift resistance/channel resistance ratio ensures stable Rds(on) across temperature.
  • Low Rds(on) × Qgd product: Reduces switching losses and improves efficiency.
  • Improved diode performance: Low forward voltage (VDSF=-1.35V typ. at VGS=-5V).
  • Surface-Mount TOLL Package: Supports automated assembly and improved thermal/electrical performance in compact systems.

With these new 650V TOLL-packaged SiC MOSFETs, Toshiba strengthens its position in the fast-growing wide bandgap semiconductor market. Expect further portfolio expansion as demand for higher efficiency, smaller form factors, and renewable/EV infrastructure accelerates.

Original – Toshiba