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Navitas Semiconductor announced the appointment of Cristiano Amoruso to the company’s board of directors, effective immediately.
Mr. Amoruso most recently served as Chief Executive Officer of Suniva, Inc., the largest private U.S.-based manufacturer of solar photovoltaic semiconductors, and as a partner at Lion Point Capital, L.P., a global investment firm. He is an accomplished investor with significant operating expertise and a strong track record of value creation in the technology and renewable energy industries across public and private companies.
“We are glad to welcome Cristiano to the board at this pivotal time for Navitas,” said Richard Hendrix, chair of the Navitas board. “Cristiano brings meaningful experience driving growth at semiconductor companies, and we are confident he will contribute to our efforts to capture the multi-billion dollar market opportunity ahead of us. Importantly, Cristiano’s appointment builds on our recent actions to strengthen our corporate governance and accelerate our path to profitability for the benefit of our stockholders.”
Mr. Amoruso commented, “Navitas’ gallium nitride (GaN) and silicon carbide (SiC) products have tremendous untapped potential and are accelerating a paradigm shift across the entire technology hardware industry, especially in power intensive applications like datacenters, solar power plants and electric vehicles. I am excited to join the Navitas board and look forward to working with management and my fellow directors to create long-term value.”
In connection with his appointment to the board, Mr. Amoruso will stand for election as an independent Class I director at the company’s 2025 annual stockholders’ meeting along with Gene Sheridan and Ranbir Singh. Additional details will be provided in Navitas’ definitive proxy statement for the meeting to be filed with the U.S. Securities and Exchange Commission (SEC).
Original – Navitas Semiconductor
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Nexperia announced its financial results for the fiscal year 2024. Amid persistent macroeconomic uncertainty and cyclical market softness, the company demonstrated resilience, achieving stable revenues and maintaining profitability through a strong focus on execution and a commitment to innovation.
Nexperia closed the 2024 financial year with a total revenue of $2.06 billion. The market share, in defined markets, increased to 9.7%, up from 8.9% in 2023. For the coming year, the company maintains a positive outlook, supported by improving gross margin and cash flow. These positive trends, already evident in Q4 2024 and continuing into Q1 2025, reflect early signs of recovery and renewed operational momentum, with Net Income surpassing Q1’24 by +$32 million.
During the reporting year, Nexperia celebrated key milestones that underscored its commitment to technological innovation and long-term growth. Most notably, the company marked the 100th anniversary of its Hamburg site in Germany – a historic hub of engineering excellence. In recognition of this legacy, Nexperia made substantial investments in next-generation manufacturing capabilities, specifically in Silicon Carbide (SiC) and Gallium Nitride (GaN) technologies.
As part of its long-term strategy, Nexperia also continues to increase its R&D spending, which grew by 6.2% in 2024. This underscores the company’s focus on advancing high-performance semiconductors for automotive, industrial, and energy-efficient applications. This investment supports innovation in wide-bandgap technologies such as SiC and GaN, as well as upgrading and expanding our product portfolio in Power Discretes, Modules, Analog & Power ICs.
2024 was also a year of transition and transformation. Strategic changes included the realignment of business groups to sharpen focus on innovation and value creation, as well as the addition of new executive leadership to guide the next phase of development.
Nexperia’s guidance for the next year acknowledges that the market will continue to present challenges, but the company expects to maintain financial momentum, amplified by ongoing improvements in operational efficiency and a strong position in the automotive sector. Given the essential role of semiconductors in the global megatrends of electrification, digitalization, automation, and green energy transition, Nexperia is well-positioned to capitalize on long-term demand. For example in AI – the demand for semiconductors in AI servers is surging, driven by the exponential growth of artificial intelligence applications across industries. Nexperia sees opportunities in servers, smartphones, computers and industrial automation.
“We anticipate that shifts in global demand, particularly in the electronics and automotive sectors, will have a greater impact than any direct regulatory measures”, said Stefan Tilger, CFO of Nexperia. “As customers reevaluate their production strategies, a flexible response will be essential. While trade dynamics and pricing pressure continue to influence the industry, Nexperia benefits from a robust global infrastructure and experienced teams that consistently deliver with reliability, agility, and a focus on innovation. Being externally debt free further strengthens our resilience and ability to invest strategically.”
“At Nexperia, we are proud to play an essential role in enabling a more sustainable future,” said Zhang Xuezheng (Wing), Chairman and CEO of Nexperia. “Our technology powers the systems that drive energy efficiency, electrification, and smarter infrastructure across industries. As global demand for sustainable solutions continues to grow, our business is uniquely positioned to deliver the innovation, scale, and reliability needed to support this transformation. We are encouraged by recent positive developments and remain focused on long-term value creation.”
Nexperia is also committed toward its sustainability goals, ensuring responsible business practices remain central to its strategy. The company aims to be carbon neutral for Scope 1 and 2 emissions by 2035.
Original – Nexperia
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CVD Equipment Corporation announced its financial results for the first quarter ended March 31, 2025.
Manny Lakios, President and CEO of CVD Equipment Corporation, stated, “First quarter 2025 revenue was $8.3 million, up 69.0% versus the prior year quarter and up 12.2% from the fourth quarter of 2024. Revenue from our CVD Equipment segment was driven by revenue recognized principally from two contracts, one in the industrial market and one in aerospace. Our SDC segment continued to see strong demand for its gas delivery equipment.”
Mr. Lakios added, “With the increased revenue and lower than expected orders in the quarter of $2.8 million, our backlog declined during the quarter from $19.4 million at December 31, 2024 to $13.8 million at March 31, 2025. Our net income for the quarter was $360,000. While the first quarter of 2025 represents the third consecutive quarter of net income, due to the nature of our business we expect that our order and revenue levels will continue to fluctuate given the markets we serve. In addition, the recent imposition of tariffs has presented us with new challenges and uncertainty as such tariffs may affect our costs of components and materials as well as contribute to economic uncertainty which may potentially affect our order rate. We are evaluating the tariff environment and planning accordingly. We are staying the course on our strategic efforts to maintain and grow our order rate, while carefully managing our expenses to achieve our goal of long-term profitability and positive cash flow, while simultaneously focusing on growth and return on investment.”
First Quarter 2025 Financial Performance
- Revenue of $8.3 million, up $3.4 million or 69.0% year over year primarily due to higher system revenues and higher sales of parts and spares in our CVD Equipment segment.
- Gross profit margin was 32.4%, an improvement from 16.2% in the prior year quarter that was primarily the result of overall higher revenues, improved absorption of overhead as well as improved margins on contracts in progress as compared to contracts in progress in the prior year quarter.
- Operating income of $269,000.
- Net income of $360,000 million or $0.05 basic and diluted share, compared to a net loss of $1.5 million or $(0.22) per basic and diluted share for the prior year first quarter.
- Cash and cash equivalents of $10.2 million as of March 31, 2025, as compared to $12.6 million as of December 31, 2024.
First Quarter 2025 Operational Performance
- Orders for the first quarter were $2.8 million, principally from our SDC segment.
- In early April 2025, we received a $1.2 million semiconductor system order in our CVD Equipment segment.
- During the quarter, we implemented a plan to reduce our operating costs to be consistent with current customer demand. This resulted in a reductionin our workforce during the quarter. We continue to evaluate the demand for our products and opportunities to reduce our operating costs.
Original – CVD Equipment
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Magnachip Semiconductor Corporation announced financial results for the first quarter 2025.
Q1 Results Summary
- Consolidated revenue from continuing operations (which includes Power Analog Solutions (“PAS”) and Power IC (“PIC”) businesses) of $44.7 million was in line with the mid-point of guidance range of $42.0 to $47.0 million. Excluding Transitional Foundry Services, revenue from continuing operations increased 12.1% year-over-year.
- Consolidated gross profit margin from continuing operations of 20.9% was above the high-end of guidance range of 18.5% to 20.5%.
- Repurchased approximately 0.3 million shares for an aggregate purchase price of $1.1 million during the quarter and ended Q1 with cash of $132.7 million.
- Announced the shutdown of Display business, which is now classified as discontinued operations from Q1 2025.
Q1 2025 Highlights
- Q1 was the fourth consecutive quarter of year-over-year growth from continuing operations primarily driven by Power Analog Solutions (PAS) growth in Communications, as well as strength in Power IC.
- PAS revenue from the Communication market was up 64% year-over-year.
- Power IC (PIC) business increased 44.1% year-over-year in Q1 driven by strength for both TV-LED and OLED power ICs.
- Released 27 new-generation PAS products that are ready for commercial sampling.
- 50 design-wins in Q1, up 13.6% from the 44 wins achieved in the year ago quarter. The design-wins include both new generation Gen 6 Super Junction products and low-voltage Gen 8 MOSFETs, as well as prior generation medium-voltage and Super Junction products.
YJ Kim, Magnachip’s CEO, said, “We delivered our fourth consecutive quarter of year-over-year growth from continuing operations, fueled by strong design-wins and momentum in Power Analog Solutions (PAS) and Power IC (PIC). In Q1 alone, we released 27 new-generation PAS products that are fully qualified and ready for commercial sampling, with design-wins spanning the Industrial, Automotive, Consumer, and Communication markets. We currently plan to launch a total of more than 40 new-generation PAS products in 2025 and approximately 55 more in 2026. These innovations not only open new revenue opportunities but are also expected to drive higher gross margins over time. While we remain mindful of geopolitical and macroeconomic uncertainties, we currently forecast sequential and year-over-year growth in revenue for continuing operations of PAS and PIC businesses in Q2.”
YJ Kim added, “Through our 3-3-3 strategy—targeting $300 million in annual revenue, a 30% gross margin, and a three-year execution horizon—we are aligning our product roadmap, R&D investments, and operational priorities to drive structural improvements and sustainable profitability.”
Shinyoung Park, Magnachip’s CFO, said, “In Q1, Magnachip achieved 12.1% year-over-year revenue growth from continuing operations and increased gross margin to 20.9%, up from 17.6% a year ago on an equivalent basis and exceeding the high-end of guidance. We expect to realize significant cost savings from the shutdown of our Display business, resulting in a 30% to 35% reduction in annualized operating expenses. Our balance sheet remains strong, and we are focused on prudent capital allocation as we transition to a more efficient, growth-oriented business model. This structural shift is creating a foundation for sustainable profitability and positions us to create long-term value for shareholders.”
Original – Magnachip Semiconductor
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Infineon Technologies AG has introduced the CoolGaN™ bidirectional switch (BDS) 650 V G5, a gallium nitride (GaN) switch capable of actively blocking voltage and current in both directions. Featuring a common-drain design and a double-gate structure, it leverages Infineon’s robust gate injection transistor (GIT) technology to deliver a monolithic bidirectional switch, enabled by Infineon’s CoolGaN technology. The device serves as a highly efficient replacement for traditional back-to-back configurations commonly used in converters.
The bidirectional CoolGaN switch offers several key advantages for power conversion systems. By integrating two switches in a single device, it simplifies the design of cycloconverter topologies, enabling single-stage power conversion, eliminating the need for multiple conversion stages. This leads to improved efficiency, increased reliability, and a more compact design. BDS-based microinverters also benefit from higher power density and reduced component count, which simplifies manufacturing and reduces costs. Additionally, the device supports advanced grid functions such as reactive power compensation and bidirectional operation.
As a result, this solution holds significant potential across a wide range of applications, including:
Microinverters: The CoolGaN bidirectional switch enables simpler and more efficient microinverter designs, reducing both size and cost. This makes microinverters more attractive for residential and commercial solar installations.
Energy Storage Systems (ESS): In ESS applications such as battery chargers and dischargers, the switch allows for more efficient and reliable energy storage and release.
Electric Vehicle (EV) Charging: In EV charging systems, the BDS switch supports faster, more efficient charging while also enabling vehicle-to-grid (V2G) functionality, where energy stored in the vehicle battery can be fed back into the grid.
Motor control: The CoolGaN BDS is ideal for use in Current Source Inverters (CSI) for industrial motor drives. Compared to traditional Voltage Source Inverters (VSI), CSIs offer benefits such as:
- Producing a sinusoidal output voltage, which supports longer cable runs, reduced losses, and improved fault tolerance.
- Replacing the DC-link capacitor with an inductor, improving high-temperature performance and short-circuit protection.
- Higher efficiency at partial loads, lower EMI, inherent buck-boost capability for voltage variation, and scalability for parallel operation.
These features make CSIs a more robust and efficient alternative for industrial motor applications.
AI data centers: In AI server power supplies, bidirectional switches like CoolGaN support higher switching frequencies and power density in architectures such as Vienna rectifiers and H4 PFCs. A single CoolGaN BDS can replace two conventional switches, reducing component count, cost, size, and overall power losses.
The CoolGaN bidirectional switch (BDS) 650 V G5 is available for ordering now as well as samples of the 110 mΩ product. More information is available here.
Original – Infineon Technologies
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To enable the next generation of solid-state power distribution systems, Infineon Technologies AG is expanding its silicon carbide (SiC) portfolio with the new CoolSiC™ JFET product family. The new devices deliver minimized conduction losses, solid turn-off capability, and high robustness, making them ideal for advanced solid-state protection and distribution.
With robust short-circuit capability, thermal stability in linear mode, and precise overvoltage control, CoolSiC JFETs enable reliable and efficient system performance in a wide range of industrial and automotive applications, including solid-state circuit breakers (SSCBs), AI data center hot-swaps, eFuses, motor soft starters, industrial safety relays, and automotive battery disconnect switches.
“With CoolSiC JFET, we are addressing the growing demand for smarter, faster, and more robust power distribution systems,” says Dr. Peter Wawer, Division President Green Industrial Power at Infineon Technologies. “This application-driven power semiconductor technology is specifically designed to provide our customers with the tools they need to solve the complex challenges in this rapidly evolving space. We are proud to introduce devices that achieve best-in-class R DS(ON), setting a new standard for SiC performance and reaffirming Infineon’s leadership in the field of wide-bandgap technology.”
The first generation of CoolSiC JFETs features ultra-low R DS(ON) starting at 1.5 mΩ (750 V BDss) and 2.3 mΩ (1200 V BDss), significantly reducing conduction losses. The bulk-channel optimized SiC JFET offers high robustness under short-circuit and avalanche failure conditions. Housed in a Q-DPAK top-side cooled package, the devices support easy paralleling and scalable current handling, enabling compact, high-power systems with flexible layout and integration options. Their predictable switching behavior under thermal stress, overload and fault conditions provides maximum long-term reliability in continuous operation.
To meet the thermal and mechanical challenges of harsh application environments, CoolSiC JFETs leverage Infineon’s advanced .XT interconnection technology with diffusion soldering. This significantly improves transient thermal impedance and robustness under pulsed and cyclic loads typical of industrial power systems. Tested and qualified under real-world operating conditions of solid-state power switches and based on the industry-standard Q-DPAK package, the devices enable quick and seamless design integration in both industrial and automotive applications.
Engineering samples of the new CoolSiC JFET family will be available later in 2025, with volume production starting in 2026. The product portfolio will be further expanded with a variety of packages and modules. The product family has been successfully demonstrated at the Infineon booth at PCIM Europe 2025 in Nuremberg. More information is available at www.infineon.com/jfet.
Original – Infineon Technologies
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Wolfspeed, Inc. announced the appointments of Paul Walsh and Mark Jensen to the Company’s Board of Directors (the “Board”). Both Mr. Walsh and Mr. Jensen will serve as members of the Audit Committee.
Tom Werner, Chairman of the Board, commented, “We are pleased to add two highly-qualified directors, Paul and Mark, to our Board. They both bring invaluable industry experience and deep expertise in accounting, finance and restructuring. Their backgrounds position them well to help the Board and Company navigate ongoing discussions with lenders and reach a comprehensive solution to address our balance sheet. We continue to make meaningful progress in these negotiations and we believe guidance from both Paul and Mark will be critical to our efforts in reaching an outcome that will support our long-term success.”
Mr. Walsh most recently served as Chief Financial Officer and Senior Vice President, Finance and Administration of Allegro Microsystems, a global designer, developer, fabless manufacturer and marketer of sensor integrated circuits (ICs) and application-specific analog power ICs, from 2014 to 2022. He previously served as Chief Financial Officer of Rocket Software and held multiple finance roles at Silicon Laboratories, earning successive promotions and ultimately serving as Senior Vice President and Chief Financial Officer. He currently serves on the boards of Kopin Corporation and Semtech Corporation.
Mr. Jensen brings an extensive background in finance and accounting, having most recently served as U.S. Managing Partner, Technology Industry, at Deloitte from 2001 to 2012. Before joining Deloitte, he held senior roles as Chief Financial Officer of Redleaf Group and Managing Partner at Arthur Andersen. Mr. Jensen currently serves on the boards of 23andMe and Lattice Semiconductor.
Wolfspeed also today announced that Stacy Smith will not stand for re-election to the Board and will leave the Board prior to the Company’s 2025 annual meeting of shareholders.
Mr. Smith commented, “I am proud of the role Wolfspeed is playing in driving innovation and energy efficiency through its leadership in silicon carbide technology. I’m grateful for my time serving on the Board of this company that is critically important to U.S. national security. Wolfspeed is in excellent hands with its new CEO, Robert Feurle, and the entire Board under Tom Werner’s tireless and capable leadership.”
Mr. Werner concluded, “On behalf of the Board, I want to thank Stacy for his dedicated service and valued contributions to Wolfspeed during his tenure, particularly during his time as Lead Independent Director. We wish him the best in all of his future endeavors.”
Original – Wolfspeed
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Infineon Technologies AG and Visteon Corporation, a global leader in automotive cockpit electronics, announced the companies have signed a Memorandum of Understanding (MOU) to advance the development of next-generation electric vehicle powertrains.
In this joint effort, Infineon and Visteon will collaborate and integrate power conversion devices based on Infineon semiconductors, with particular emphasis on wideband gap device technologies, which provide significant advantages in power conversion applications compared to silicon-based semiconductors. These devices include greater power density, efficiency and thermal performance, which contribute to improved efficiency and reduced system costs for next-generation power conversion modules for the automotive sector.
Future Visteon EV powertrain applications incorporating Infineon CoolGaN™ (Gallium Nitride) and CoolSiC™ (Silicon Carbide) devices may include battery junction boxes, DC-DC converters and on-board chargers. The resulting powertrain systems will conform to the highest efficiency, robustness and reliability.
“Working with Infineon allows us to integrate cutting-edge semiconductor technologies that are essential in improving power conversion efficiency and overall system capability of next generation electric vehicles,” said Dr. Tao Wang, Head of the Electrification Product Line of Visteon Corporation. “This collaboration will advance technologies that accelerate the transition to a more sustainable and efficient mobility ecosystem.”
“Visteon is a recognized innovator and an early adopter of new technologies, making them an ideal partner for us,” said Peter Schaefer, Chief Sales Officer Automotive, Infineon Technologies AG. “Together, we will push the boundaries of electric vehicle technology and provide superior solutions to the global automotive industry.”
Original – Infineon Technologies
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Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world, announced its consolidated results of operations for the three months ended March 31, 2025.
First Quarter 2025 Highlights
- Revenue was $2,247.2 million in 1Q25, compared to $2,207.3 million in 4Q24, and $1,750.2 million in 1Q24.
- Gross profit was $505.9 million in 1Q25, compared to $499.0 million in 4Q24, and $239.7 million in 1Q24.
- Gross margin was 22.5% in 1Q25, compared to 22.6% in 4Q24 and 13.7% in 1Q24.
The following statements are forward looking statements based on current expectations and involved risks and uncertainties.
Second Quarter 2025 Guidance
The Company expects (in accordance with IFRSs):
- Revenue to decrease by 4% to 6% QoQ.
- Gross margin to range from 18% to 20%.
Management Comments
In the first quarter, the Company achieved total revenue of $2,247 million, up 1.8% sequentially; gross margin was 22.5%, remaining roughly flat sequentially; the capacity utilization rate increased by 4.1 percentage points sequentially to 89.6%.
The Company’s second quarter guidance is as follows: revenue is expected to decrease 4% to 6% sequentially, and the gross margin is expected to be in the range of 18% to 20%.
The Company believes that the second half of the year presents both opportunities and challenges. The Company will enhance its adaptability and risk resilience capability. The Company’s top priority remains as strategic focus on its core business and near-term deliverables.
Original – SMIC
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DENSO CORPORATION and ROHM Co., Ltd. announced that the two companies have reached a basic agreement to establish a strategic partnership in the semiconductor field. This agreement follows discussions and considerations that began in September 2024.
Recently, the importance of semiconductors that support the electrification and intelligence of vehicles has been increasing significantly. This is driven by the development and spread of electric vehicles aimed at achieving carbon neutrality, as well as the realization of automated driving, which is expected to contribute to zero fatalities in traffic accidents.
DENSO and ROHM have a long-standing collaboration in the trade and development of automotive semiconductors. Going forward, both companies will integrate DENSO’s advanced system construction capabilities in the automotive sector with ROHM’s cutting-edge semiconductor technology, cultivated in the consumer market. This partnership will focus on enhancing the lineup of high-quality devices, particularly analog ICs, that support vehicle electrification and intelligence, and deepening collaboration in development. Additionally, in highly compatible fields within their semiconductor businesses, both companies will discuss broad collaboration. By globally supplying products created through this co-creation, both companies aim to contribute to technological innovation in the automotive field and realize a sustainable mobility society.
To further solidify this partnership, DENSO and ROHM will continue to consider strengthening their capital relationship.
DENSO CORPORATION President & CEO, Shinnosuke Hayashi
DENSO positions semiconductors as key devices to realize next-generation vehicle systems and has been deepening its cooperative relationships with semiconductor manufacturers that possess rich experience and knowledge. ROHM has a wide range of semiconductor lineups that are crucial for automotive electronics products, essential for vehicle intelligence and electrification. We are very pleased that the partnership with ROHM is progressing smoothly. By further deepening the collaboration between both companies and integrating DENSO’s accumulated automotive technology and expertise, we believe we can contribute to the development of the mobility society through stable supply and enhanced product value.ROHM Co., Ltd. President (Representative Director), Katsumi Azuma
We are very pleased to deepen our collaborative relationship with DENSO, a leader in technological innovation for the mobility society. This partnership not only strengthens our relationship as suppliers but also envisions broad collaboration in the semiconductor business of both companies. Initially, we will focus on the development of analog ICs related to next-generation systems such as electrification, automated driving, and connected vehicles. Furthermore, without narrowing the scope, we will integrate our respective technologies, knowledge, and assets across a wide range of fields to contribute to technological innovation and stable supply in the automotive industry.Original – DENSO
